  
          |
|
Encapsulants
These
are some of our most popular products, but we
can create a custom formulation for you.
Click
on a product number to see Data Sheet for viewing and printing.
You will need Adobe Acrobat Reader in order to view the Data Sheets.
If you do not have Adobe Acrobat Reader, click here for a free download.
|
804 - 86 |
A
two component (A + B),
room temperature cured, alumina filled, flame retardant epoxy
encapsulant and potting compound. |
|
805
- 53 |
A
one component, heat cured, slightly thixotropic, 100% solids, liquid
epoxy encapsulant and insulating compound. |
|
805-86-2 |
A two component (A
+ B), convenient 1:1 mix ratio epoxy encapsulant and insulating compound
featuring low exotherm during cure. |
|
806
- 62 |
A
two component (A + B) high performance, room temperature curing
liquid epoxy hybrid adhesive and potting compound. |
|
807
- 30 |
A
two component (A + B) high performance, room temperature curing
epoxy insulating coating compound. This material is designed
to yield moderate set up times along with a putty like consistency
for ease of application. |
|
807
- 32 |
A
two component (A + B) alumina oxide filled, room temperature curing,
liquid epoxy potting compound. |
|
807
- 38 |
A
two component (A + B) unfilled, heat curing, low viscosity, liquid epoxy encapsulant
for filament winding and impregnation. |
|
807
- 53 |
A
two component (A + B) high performance, mineral filled, heat curing
potting compound that features a moderate set up time. |
|
807
- 63 |
A
two component (A + B) unfilled, room temperature cure, water white, liquid epoxy encapsulant. |
|
807
- 65 |
A
two component (A + B) high performance, mineral filled, room
temperature curing, potting compound that features a moderate set up
time and has electrical grade insulation properties, unusually high
thermal conductivity and low thermal expansion. |
|
807
- 80 |
A
two component (A + B) mineral filled, low viscosity, liquid epoxy encapsulant
and potting compound featuring 130°C operation temperature. |
|
808
- 03 |
A
two component (A + B) oxide filled, room temperature cure, liquid epoxy encapsulant
and potting compound featuring thermal expansion. |
|
808 - 10 |
A
two component (A + B) , liquid epoxy encapsulant and potting
compound featuring lowest thermal expansion and highest thermal K. |
|
904 - 38 |
A two component (A + B)
,
addition cured silicone encapsulant and insulating compound used for
flexible moldings and fuser rolls. |
See something you want to investigate further? Contact Us!
Adhesives
Castings Conductives
Specialty Products
Coatings Urethanes and Acrylics UV Cured
Back
to top
|
